ASML is collaborating with Samsung and TSMC to develop larger reticles for chip machines, aiming to increase productivity and reduce production costs.
Key facts
- •ASML is working with TSMC and Samsung to develop 12-inch reticles to replace the current six-inch standard.
- •The companies aim to begin trials for the new reticle system in 2031, with production implementation targeted for 2033.
- •Samsung plans to introduce High-NA EUV lithography for DRAM memory chip production in 2028.
- •TSMC intends to begin deploying High-NA EUV technology in 2030.
- •High-NA EUV machines are designed to project chip designs at higher resolutions to increase manufacturing speed.
Veldhoven-based ASML has launched a collaboration with major clients TSMC and Samsung to develop advanced chip manufacturing technology. The initiative focuses on utilizing larger reticles in chip machines to improve productivity for the most advanced semiconductors. The companies aim to begin trials for this system by 2031, with the goal of implementing the technology for production two years later.
Expanding Reticle Technology
Reticles function as blueprints for printing circuit patterns onto semiconductors. Currently, these components are standardized at six inches, but the collaboration seeks to increase their size to 12 inches. ASML anticipates that this shift could lower production costs, a development that follows a global shortage of memory chips driven by the rise of AI applications.
Adoption of High-NA EUV Lithography
In addition to the reticle project, TSMC and Samsung have committed to timelines for adopting ASML’s High-NA EUV lithography machines. These systems, which are more expensive than previous generations, offer higher resolution to improve chip performance and manufacturing speeds. Samsung plans to use the technology for mass-producing DRAM memory chips by 2028, while TSMC intends to deploy it in 2030. Intel has also previously purchased these machines.
Timeline
- 2028Samsung plans to introduce High-NA EUV technology for mass-producing DRAM memory chips.
- 2030TSMC intends to begin deploying High-NA EUV lithography technology.
- 2031ASML aims to begin trials for the new 12-inch reticle system.
- 2033The target date for using larger reticles in the production of advanced chips.
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This article was independently rewritten by ManyPress editorial AI from reporting originally published by NL Times.
